Volume 17; Issue 2

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IEEE Transactions on Components Packaging and Manufacturing...
Volume 17; Issue 2

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volume 17; Issue 2

1

Effects of losses on signals in PWB's

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 513 KB

english, 1994

2

Package inductance characterization at high frequencies

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 815 KB

english, 1994

3

Technology application tradeoff studies in multichip systems

Sandborn, P.A., Hashemi, H., Bal, L., Abadir, M.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 984 KB

english, 1994

4

Holographic optical interconnects for VLSI multichip modules

Feldman, M.R., Morris, J.E., Turlik, I., Magill, P., Adema, G., Raja, M.Y.A.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 561 KB

english, 1994

5

Design of low dielectric glass+ceramics for multilayer ceramic substrate

Jean, J.-H., Gupta, T.K.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 640 KB

english, 1994

6

SPICE simulation of lossy and coupled interconnection lines

Vu Dinh, T., Cabon, B., Chilo, J.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 1.13 MB

english, 1994

7

Planarized thin film inductors and capacitors for hybrid integrated circuits made of aluminum and anodic alumina

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 291 KB

english, 1994

8

A method to predict cracking in IC plastic packages

Margaritis, G., McGarry, F.J.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 685 KB

english, 1994

9

Broadband modeling and transient analysis of MCM interconnections

Peeters, J., Beyne, E.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 807 KB

english, 1994

10

Adaptation of "SPICE3" to simulation of lossy multiple-coupled transmission lines

Dongjin Lee,, Palusinski, O.A.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 636 KB

english, 1994

11

Advanced design and modeling for manufacturability of a hybrid MCM package

Kadakia, S.D., Donovan, T.E., Gupta, D., Bhatia, H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 571 KB

english, 1994

12

Predicting delamination in plastic IC packages and determining suitable mold compound properties

Tay, A.A.O., Tan, G.L., Lim, T.B.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 728 KB

english, 1994

13

Delay macromodels for point-to-point MCM interconnections

Kayssi, A.I., Sakallah, K.A.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 611 KB

english, 1994

14

Dynamic probe scheduling optimization for MCM substrate test

Nan-Chi Chou,, Chung-Kuan Cheng,, Russell, T.C.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 953 KB

english, 1994

15

Next generation burn-in development

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 681 KB

english, 1994