Electrical characterization of ball grid array packages...

Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz

Jaeyong Jeong,, Seungki Nam,, Shin, Y.S., Kim, Y.S., Jichai Jeong,
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Volume:
22
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.784483
Date:
January, 1999
File:
PDF, 200 KB
english, 1999
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