Test chips, test systems, and thermal test data for...

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1994 / Sept. Vol. 17; Iss. 3

Test chips, test systems, and thermal test data for multichip modules in the ESPRIT-APACHIP project

O'Mathuna, S.C., Fromont, T., Koschnick, W., O'Connor, L.
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Volume:
17
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.311752
Date:
January, 1994
File:
PDF, 1.24 MB
english, 1994
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