Electrical Characterization of NCP- and NCF-Bonded...

IEEE Transactions on Advanced Packaging 2006 / 11 Vol. 29; Iss. 4

Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages

Chan, Y. C., Tan, S. C., Lui, Nelson S. M., Tan, C. W.
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2006.884814
Date:
November, 2006
File:
PDF, 1.71 MB
english, 2006
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