IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1994 / 5 Vol. 17; Iss. 2
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SPICE simulation of lossy and coupled interconnection lines
Vu Dinh, T., Cabon, B., Chilo, J.Volume:
17
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.330437
Date:
May, 1994
File:
PDF, 1.13 MB
english, 1994