Flow time measurements for underfills in flip-chip...

IEEE Transactions on Components and Packaging Technologies 2005 / 06 Vol. 28; Iss. 2

Flow time measurements for underfills in flip-chip packaging

Jinlin Wang,
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.848488
Date:
June, 2005
File:
PDF, 372 KB
english, 2005
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