Application of lead-free eutectic Sn-Ag solder in no-clean...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1994 / Nov. Vol. 17; Iss. 4

Application of lead-free eutectic Sn-Ag solder in no-clean thick film electronic modules

Shangguan, D., Achari, A., Green, W.
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Volume:
17
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.338730
Date:
January, 1994
File:
PDF, 926 KB
english, 1994
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