Volume 17; Issue 4

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IEEE Transactions on Components Packaging and Manufacturing...
Volume 17; Issue 4

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volume 17; Issue 4

1

Measurement of dielectric anisotropy of BPDA-PDA polyimide in multilayer thin-film packages

Deutsch, A., Swaminathan, M., Ree, M.-H., Surovic, C.W., Arjavalingam, G., Prasad, K., McHerron, D.C., McAllister, M., Kopcsay, G.V., Giri, A.P., Perfecto, E., White, G.E.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 753 KB

english, 1994

2

Efficient frequency-domain modeling and circuit simulation of transmission lines

Silveira, L.M., Elfadel, I.M., White, J.K., Chilukuri, M., Kundert, K.S.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 916 KB

english, 1994

3

Metal diffusion in polymers

Das, J.H., Morris, J.E.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 656 KB

english, 1994

4

A bare-chip probe for high I/O, high speed testing

Barber, A., Keunmyung Lee,, Obermaier, H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 788 KB

english, 1994

5

Lead inductance of tape carrier package for high-speed LSI's

Takada, M., Gofuku, E., Narutaki, Y., Shimamoto, H., Matsukawa, F., Nunoshita, M.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 567 KB

english, 1994

6

Single point ILB at narrow pitch

Dehaine, G., Courant, P.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 488 KB

english, 1994

7

A contribution to the design of plastic packages for high voltage power integrated circuits

Albertini, M., Bozzo, R., Tiziani, R.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 667 KB

english, 1994

8

Statistical method of noise estimation in a synchronous system

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 582 KB

english, 1994

9

Application of lead-free eutectic Sn-Ag solder in no-clean thick film electronic modules

Shangguan, D., Achari, A., Green, W.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 926 KB

english, 1994

10

Selection of IR detectors for a fast laser soldering process with simultaneous solder joint qualification

Nicolics, J., Schrottmayer, D., Musiejovsky, L.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 732 KB

english, 1994

11

Effect of CMOS driver loading conditions on simultaneous switching noise

Vaidyanath, A., Thoroddsen, B., Prince, J.L.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 525 KB

english, 1994

12

Characterization of polyimides used in high density interconnects

Pecht, M., Xin Wu,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 669 KB

english, 1994

13

Coupled noise predictors for lossy interconnects

Katopis, G.A., Smith, H.H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 537 KB

english, 1994

14

Degradation of TAB outer lead contacts due to the Au-concentration in eutectic tin/lead solder

Zakel, E., Azdasht, G., Reichl, H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 922 KB

english, 1994

15

Electrical packaging requirements for low-voltage ICs-3.3 V high-performance CMOS devices as a case study

Senthinathan, R., Mehra, A., Mahalingam, M., Doi, Y., Astrain, H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 1.21 MB

english, 1994

16

Gold-to-gold TAB ILB with a laser

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 539 KB

english, 1994

17

Scattering parameter-based simulation of transients in lossy nonlinearly terminated packaging interconnections

Vakanas, L.P., Cangellaris, A.C., Palusinski, O.A.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 763 KB

english, 1994

18

Optimization and reliability evaluation of a laser inner lead bonding process

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 683 KB

english, 1994

19

Demountable TAB-a new path for TAB technology

Pendse, R.D., Afshari, B., Heflinger, B., Matta, F., Rastogi, V.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 920 KB

english, 1994

20

TBGA package technology

Andros, F.E., Hammer, R.B.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 548 KB

english, 1994

21

Energy based methodology for damage and life prediction of solder joints under thermal cycling

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 520 KB

english, 1994

22

Reliability investigations of different tape metallizations for TAB-outer lead bonding

Zakel, E., Azdasht, G., Kruppa, P., Reichl, H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 950 KB

english, 1994

23

The signal transmission characteristics of embedded microstrip transmission lines over a meshed ground plane in copper/polyimide multichip module

Chung-Ping Chien,, Burnett, A.F., Cech, J.M., Tanielian, M.H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 631 KB

english, 1994

24

Modeling and measurement of a high-performance computer power distribution system

Evans, R., Tsuk, M.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1994

Language:

english

File:

PDF, 495 KB

english, 1994