On the design parameters of flip-chip PBGA package assembly...

IEEE Transactions on Components and Packaging Technologies 2001 / 6 Vol. 24; Iss. 2

On the design parameters of flip-chip PBGA package assembly for optimum solder ball reliability

Verma, K., Seung-Bae Park,, Bongtae Han,, Ackerman, W.
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Volume:
24
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.926397
Date:
June, 2001
File:
PDF, 236 KB
english, 2001
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