Volume 24; Issue 2

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IEEE Transactions on Components and Packaging Technologies
Volume 24; Issue 2

IEEE Transactions on Components and Packaging Technologies

Volume 24; Issue 2

1

Modeling of the thermal and hydraulic performance of plate fin, strip fin, and pin fin heat sinks-influence of flow bypass

Jonsson, H., Moshfegh, B.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 228 KB

english, 2001

2

Assessment of high-heat-flux thermal management schemes

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 518 KB

english, 2001

3

Thermal characterization of a liquid cooled AlSiC base plate with integral pin fins

Moores, K.A., Joshi, Y.K., Schiroky, G.H.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 177 KB

english, 2001

4

High heat flux heat pipe mechanism for cooling of electronics

Zuo, Z.J., North, M.T., Wert, K.L.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 142 KB

english, 2001

5

Optimization of plate fin heat sinks using entropy generation minimization

Culham, J.R., Muzychka, Y.S.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 144 KB

english, 2001

6

A methodology for the design of perforated tiles in raised floor data centers using computational flow analysis

Kang, S., Schmidt, R.R., Kelkar, K.M., Radmehr, A., Patankar, S.V.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 137 KB

english, 2001

7

Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies

Lau, J.H., Chang, C., Lee, S.-W.R.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 551 KB

english, 2001

8

Computational parameter study of chip scale package array cooling

Watson, S.P., Murray, B.T., Sammakia, B.G.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 181 KB

english, 2001

9

Interfacial fracture toughness for delamination growth prediction in a novel peripheral array package

Sundararaman, V., Sitaraman, S.K.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 282 KB

english, 2001

10

Modeling contact between rigid sphere and elastic layer bonded to rigid substrate

Stevanovic, M., Yovanovich, M.M., Culham, J.R.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 113 KB

english, 2001

11

Software-based analysis of radio frequency plasma display panel for efficient design and impedance matching

Ki Hyuk Kim,, Park, H.I., Park, J.H., Sung Woo Hwang,, Kang, J.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 209 KB

english, 2001

12

Reliability of soldered joints in CSPs of various designs and mounting conditions

Sumikawa, M., Sato, T., Yoshioka, C., Nukii, T.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 179 KB

english, 2001

13

On the design parameters of flip-chip PBGA package assembly for optimum solder ball reliability

Verma, K., Seung-Bae Park,, Bongtae Han,, Ackerman, W.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 236 KB

english, 2001

14

A novel approach to the design of complex heat transfer systems: portable computer design-a case study

Nakayama, W., Behnia, M., Soodphakdee, D.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 180 KB

english, 2001

15

Immersion-cooled heat sinks for electronics: insight from high-speed photography

Bhavnani, S.H., Fournelle, G., Jaeger, R.C.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 364 KB

english, 2001

16

Application of Al/PI composite bumps to COG bonding process

Jen-Huang Jeng,, Hsieh, T.E.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 209 KB

english, 2001

17

A study of compact thermal model topologies in CFD for a flip chip plastic ball grid array package

Shidore, S., Adams, V., Lee, T.T.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 178 KB

english, 2001

18

Statistics of electric conductance through anisotropically conductive adhesive

Ying Fu,, Willander, M., Liu, J.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 117 KB

english, 2001

19

RF electrical measurements of fine pitch BGA packages

Caggiano, M.F., Ou, J., Bulumulla, S., Lischner, D.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 230 KB

english, 2001

20

Advanced thermal tester for accurate measurement of internal thermal resistance of high power electronic modules

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 167 KB

english, 2001

21

The effect of power cycling on the reliability of lead-free surface mount assemblies

Davitt, E., Stam, F.A., Barrett, J.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 383 KB

english, 2001

22

Design for manufacturability of SISE parallel plate forced convection heat sinks

Iyengar, M., Bar-Cohen, A.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2001

Language:

english

File:

PDF, 273 KB

english, 2001

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