Adaptation of "SPICE3" to simulation of lossy...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1994 / 5 Vol. 17; Iss. 2

Adaptation of "SPICE3" to simulation of lossy multiple-coupled transmission lines

Dongjin Lee,, Palusinski, O.A.
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Volume:
17
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.330438
Date:
May, 1994
File:
PDF, 636 KB
english, 1994
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