Mechanical, thermal, and electrical analysis of a compliant...

IEEE Transactions on Components and Packaging Technologies 2005 / 06 Vol. 28; Iss. 2

Mechanical, thermal, and electrical analysis of a compliant interconnect

Galloway, J., Syed, A., WonJoon Kang,, JinYoung Kim,, Cannis, J., Ka, Y., SeungMo Kim,, TaeSeong Kim,, GiSong Lee,, SangHyun Ryu,
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.848504
Date:
June, 2005
File:
PDF, 1.47 MB
english, 2005
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