Numerical simulation of stress evolution during...

IEEE Transactions on Components and Packaging Technologies 2003 / 09 Vol. 26; Iss. 3

Numerical simulation of stress evolution during electromigration in IC interconnect lines

Hua Ye,, Basaran, C., Hopkins, D.C.
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Volume:
26
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2003.817877
Date:
September, 2003
File:
PDF, 835 KB
english, 2003
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