Metal-Core Printed Circuit Board With Alumina Layer by...

Metal-Core Printed Circuit Board With Alumina Layer by Aerosol Deposition Process

Cho, Hyun Min, Kim, Hyeong Joon
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Volume:
29
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/led.2008.2001633
Date:
September, 2008
File:
PDF, 434 KB
english, 2008
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