Metal-Core Printed Circuit Board With Alumina Layer by Aerosol Deposition Process
Cho, Hyun Min, Kim, Hyeong JoonVolume:
29
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/led.2008.2001633
Date:
September, 2008
File:
PDF, 434 KB
english, 2008