Physics-Based Thermal Conductivity Model for Metallic...

IEEE Electron Device Letters 2011 / 02 Vol. 32; Iss. 2

Physics-Based Thermal Conductivity Model for Metallic Single-Walled Carbon Nanotube Interconnects

Bhattacharya, Sitangshu, Amalraj, Rex, Mahapatra, Santanu
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Volume:
32
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/led.2010.2091491
Date:
February, 2011
File:
PDF, 231 KB
english, 2011
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