Influence of Interfacial Compliance on Thermomechanical...

IEEE Transactions on Advanced Packaging 2006 / 11 Vol. 29; Iss. 4

Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging

Basaran, Cemal, Wen, Yujun
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2006.871175
Date:
November, 2006
File:
PDF, 494 KB
english, 2006
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