RF electrical measurements of fine pitch BGA packages

IEEE Transactions on Components and Packaging Technologies 2001 / 6 Vol. 24; Iss. 2

RF electrical measurements of fine pitch BGA packages

Caggiano, M.F., Ou, J., Bulumulla, S., Lischner, D.
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Volume:
24
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.926388
Date:
June, 2001
File:
PDF, 230 KB
english, 2001
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