A method of investigating fine shorting whiskers within a...

IEEE Transactions on Advanced Packaging 2001 / Feb. Vol. 24; Iss. 1

A method of investigating fine shorting whiskers within a leadframe molded package

Yen, A.C., Zheng Hongyu,, Wynn, R.T., Zhang Yaohui,, Lingfai Wang,
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Volume:
24
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.909632
Date:
January, 2001
File:
PDF, 166 KB
english, 2001
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