Volume 24; Issue 1

IEEE Transactions on Advanced Packaging

Volume 24; Issue 1

1

Experimental verification of the use of metal filled via hole fences for crosstalk control of microstrip lines in LTCC packages

Ponchak, G.E., Donghoon Chun,, Jong-Gwan Yook,, Katehi, L.P.B.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 73 KB

english, 2001

2

Journal:

IEEE Transactions on Advanced Packaging

Language:

english

File:

PDF, 223 KB

english,

3

Influence of ceramic surface treatment on peel-off strength between aluminum nitride and epoxy-modified polyaminobismaleimide adhesive

Asai, H., Iwase, N., Suga, T.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 206 KB

english, 2001

4

A 100-Gb/s throughput ATM switch MCM with a 320-channel parallel optical I/O interface

Kawano, R., Yamanaka, N., Oki, E., Yasukawa, S., Okazaki, K., Ohki, A., Usui, M., Sato, N., Katsura, K., Ando, Y., Kagawa, T., Hikita, M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 435 KB

english, 2001

5

The effects of underfill and its material models on thermomechanical behaviors of a flip chip package

Liu Chen,, Qun Zhang,, Guozhoag Wang,, Xioming Xie,, Zhaonian Cheng,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 170 KB

english, 2001

6

Simulating package behavior under power dissipation using uniform thermal loading

Wakil, J.A., Ho, P.S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 106 KB

english, 2001

7

Reliability studies μBGA solder joints-effect of Ni-Sn intermetallic compound

Chan, Y.C., Tu, P.L., Tang, C.W., Hung, K.C., Lai, J.K.L.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 254 KB

english, 2001

8

Central wavelength tunable mechanism for temperature compensated package of fiber Bragg gratings

Hsi-Hsun Tsai,, Win-Yann Jang,, Fen-Fen Yeh,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 107 KB

english, 2001

9

Integrated transient thermal and mechanical analysis of molded PBGA packages during thermal shock

Mercado, L.L., Tien-Yu Lee,, Cook, J.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 207 KB

english, 2001

10

Effect of cooling rate on the isothermal fatigue behavior of CBGA solder joints in shear

Fan, S.H., Chan, Y.C., Tang, C.W., Lai, J.K.L.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 264 KB

english, 2001

11

Multilayer planarization of polymer dielectrics

Chiniwalla, P., Manepalli, R., Farnsworth, K., Boatman, M., Dusch, B., Kohl, P., Bidstrup-Alen, S.A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 574 KB

english, 2001

12

Significance of coating stress on substrate bow in large area processing of MCM

Kwanho Yang,, Jang-Hi Im,, Heistand, R.H.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 70 KB

english, 2001

13

Post-weld-shift in dual-in-line laser package

Jao-Hwa Kuang,, Maw-Tyan Sheen,, Szu-Chun Wang,, Gow-Ling Wang,, Wood-Hi Cheng,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 156 KB

english, 2001

14

A novel high speed multitap bus structure

Barber, V.A., Keunmyung Lee,, Obermaier, H.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 178 KB

english, 2001

15

Development of microwave multilayer plastic-based multichip modules

Pham, A.-V.H., Sutono, A., Laskar, J., Krishnamurthy, V., Lester, D., Balch, E., Rose, J.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 107 KB

english, 2001

16

A method of investigating fine shorting whiskers within a leadframe molded package

Yen, A.C., Zheng Hongyu,, Wynn, R.T., Zhang Yaohui,, Lingfai Wang,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 166 KB

english, 2001