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Volume 24; Issue 1
Main
IEEE Transactions on Advanced Packaging
Volume 24; Issue 1
IEEE Transactions on Advanced Packaging
Volume 24; Issue 1
1
Experimental verification of the use of metal filled via hole fences for crosstalk control of microstrip lines in LTCC packages
Ponchak, G.E.
,
Donghoon Chun,
,
Jong-Gwan Yook,
,
Katehi, L.P.B.
Journal:
IEEE Transactions on Advanced Packaging
Year:
2001
Language:
english
File:
PDF, 73 KB
Your tags:
english, 2001
2