Evaluation of Direct Cu Electroplating on Ru: Feature Fill,...

IEEE Electron Device Letters 2011 / 02 Vol. 32; Iss. 2

Evaluation of Direct Cu Electroplating on Ru: Feature Fill, Parametric, and Reliability

Yang, C.-C., Li, B., Seo, S.-C., Molis, S., Edelstein, D.
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Volume:
32
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/led.2010.2091490
Date:
February, 2011
File:
PDF, 336 KB
english, 2011
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