The effect of power cycling on the reliability of lead-free...

IEEE Transactions on Components and Packaging Technologies 2001 / 6 Vol. 24; Iss. 2

The effect of power cycling on the reliability of lead-free surface mount assemblies

Davitt, E., Stam, F.A., Barrett, J.
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Volume:
24
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.926389
Date:
June, 2001
File:
PDF, 383 KB
english, 2001
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