A novel mechanical diced trench structure for warpage...

Microelectronics Reliability 2015 / 02 Vol. 55; Iss. 2

A novel mechanical diced trench structure for warpage reduction in wafer level packaging process

Zhu, Chunsheng, Li, Heng, Xu, Gaowei, Luo, Le
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Volume:
55
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.11.006
Date:
February, 2015
File:
PDF, 2.79 MB
english, 2015
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