Volume 55; Issue 2

Microelectronics Reliability

Volume 55; Issue 2

1

Study of the leakage current suppression for hybrid-Schottky/ohmic drain AlGaN/GaN HEMT

Tang, Cen, Xie, Gang, Sheng, Kuang

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.01 MB

english, 2015

2

Synthesis and characterisation of curcumin–M (M=B, Fe and Cu) films grown on p-Si substrate for dielectric applications

Dakhel, A.A., Cassidy, S., Jasim, Khalil E., Henari, F.Z.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.54 MB

english, 2015

3

Ultra-thin dielectric breakdown in devices and circuits: A brief review

Ho, Chih-Hsiang, Kim, Soo Youn, Roy, Kaushik

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.56 MB

english, 2015

4

Investigation and comparison of analog figures-of-merit for TFET and FinFET considering work-function variation

Lee, Ko-Chun, Fan, Ming-Long, Su, Pin

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.19 MB

english, 2015

5

Impact of the lateral straggle on the Analog and RF performance of TFET

Ghosh, Sayani, Koley, Kalyan, Sarkar, Chandan K.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1023 KB

english, 2015

6

All-digital thermal distribution measurement on field programmable gate array using ring oscillators

Yue, Yuan, Feng, Shi-Wei, Guo, Chun-Sheng, Yan, Xin, Feng, Rui-Rui

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.06 MB

english, 2015

7

A practical metric for soft error vulnerability analysis of combinational circuits

Raji, Mohsen, Pedram, Hossein, Ghavami, Behnam

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.05 MB

english, 2015

8

Thermal characterization of high power LED with ceramic particles filled thermal paste for effective heat dissipation

Hashim, Nur Hasyimah, Anithambigai, P., Mutharasu, D.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.94 MB

english, 2015

9

Variability and reliability analysis of CNFET technology: Impact of manufacturing imperfections

Almudever, Carmen G., Rubio, Antonio

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.12 MB

english, 2015

10

Modelling mutual thermal interactions between power LEDs in SPICE

Górecki, Krzysztof

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 781 KB

english, 2015

11

Electron transport mechanism of tungsten trioxide powder thin film studied by investigating effect of annealing on resistivity

Li, Wei, Sasaki, Akito, Oozu, Hideyuki, Aoki, Katsuaki, Kakushima, Kuniyuki, Kataoka, Yoshinori, Nishiyama, Akira, Sugii, Nobuyuki, Wakabayashi, Hitoshi, Tsutsui, Kazuo, Natori, Kenji, Iwai, Hiroshi

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 676 KB

english, 2015

12

A unified look at the use of successive differentiation and integration in MOSFET model parameter extraction

García-Sánchez, Francisco J., Ortiz-Conde, Adelmo, Muci, Juan, Sucre-González, Andrea, Liou, Juin J.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.29 MB

english, 2015

13

Improvement of charge/discharge performance for lithium ion batteries with tungsten trioxide electrodes

Li, Wei, Sasaki, Akito, Oozu, Hideyuki, Aoki, Katsuaki, Kakushima, Kuniyuki, Kataoka, Yoshinori, Nishiyama, Akira, Sugii, Nobuyuki, Wakabayashi, Hitoshi, Tsutsui, Kazuo, Natori, Kenji, Iwai, Hiroshi

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.81 MB

english, 2015

14

Numerical analysis of thermo-mechanical characteristics of solder joint depending on change in solder junction structure of MCP

Kwon, YongHyuk, Bang, HeeSeon, Joo, SungMin, Bang, HanSur

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.32 MB

english, 2015

15

Case study: Root cause of fluorine detection during TiN ARC layer corrosion of AlSiCu metal lines

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.23 MB

english, 2015

16

Book review

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 150 KB

english, 2015

17

Statistical analysis of the impact of refinishing process on leaded components

Yin, Chunyan, Best, Chris, Bailey, Chris, Stoyanov, Stoyan

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.25 MB

english, 2015

18

Inside front cover - Editorial board

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 38 KB

english, 2015

19

Investigation on the origin of the anomalous tail bits on nitrided charge trap flash memory

Lee, Meng Chuan, Wong, Hin Yong

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 785 KB

english, 2015

20

Phase-shift imaging ellipsometer for measuring thin-film thickness

Yu, Chih-Jen, Hung, Ching-Hung, Hsu, Kuei-Chu, Chou, Chien

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.75 MB

english, 2015

21

A physical model on electron mobility in InGaAs nMOSFETs with stacked gate dielectric

Huang, Y., Xu, J.P., Wang, L.S., Zhu, S.Y.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 511 KB

english, 2015

22

Improved performance of nanoscale junctionless transistor based on gate engineering approach

Wang, Ying, Shan, Chan, Dou, Zheng, Wang, Li-guo, Cao, Fei

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.55 MB

english, 2015

23

A novel mechanical diced trench structure for warpage reduction in wafer level packaging process

Zhu, Chunsheng, Li, Heng, Xu, Gaowei, Luo, Le

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.79 MB

english, 2015

24

High speed test interface module using MEMS technology

Kandalaft, Nabeeh, Attaran, Ali, Rashizadeh, Rashid

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.28 MB

english, 2015

25

Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40μm pitch Cu-pillar/Sn–Ag bump interconnection

Shin, Ji-Won, Kim, Il, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Jee, Young Kun, Paik, Kyung-Wook

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 3.42 MB

english, 2015