Novel through silicon via exposure process comprising Si/Cu...

Japanese Journal of Applied Physics 2014 / 05 Vol. 53; Iss. 5S2

Novel through silicon via exposure process comprising Si/Cu grinding, electroless Ni–B plating, and wet etching of Si

Watanabe, Naoya, Aoyagi, Masahiro, Katagawa, Daisuke, Bandoh, Tsubasa, Yamamoto, Eiichi
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Volume:
53
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.53.05GE02
Date:
May, 2014
File:
PDF, 1.39 MB
english, 2014
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