Volume 53; Issue 5S2

5

Advanced Metallization for ULSI Applications

Year:
2014
Language:
english
File:
PDF, 44 KB
english, 2014
9

A new Cu(TiIrN x ) film with fine thermal conductivity and its application

Year:
2014
Language:
english
File:
PDF, 754 KB
english, 2014
11

Reflow behavior of Cu–Mn in LSI line patterns

Year:
2014
Language:
english
File:
PDF, 967 KB
english, 2014
16

Lifetime prediction model of stress-induced voiding in Cu/low-κ interconnects

Year:
2014
Language:
english
File:
PDF, 283 KB
english, 2014