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Improvement of mechanical integrity of ultra low k dielectric stack and CMP compatibility
K. Schulze, S.E. Schulz, S. Frühauf, H. Körner, U. Seidel, D. Schneider, T. GessnerVolume:
76
Year:
2004
Language:
english
Pages:
8
DOI:
10.1016/j.mee.2004.07.026
File:
PDF, 647 KB
english, 2004