Volume 76; Issue 1-4

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Microelectronic Engineering
Volume 76; Issue 1-4

Microelectronic Engineering

Volume 76; Issue 1-4

1

Impact of copper dummies on interconnect propagation performance in advanced integrated circuits

B. Blampey, B. Fléchet, C. Bermond, V. Fontaine, G. Angénieux, J. Torres, A. Farcy

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 504 KB

english, 2004

2

Impact of line edge roughness on the resistivity of nanometer-scale interconnects

W. Steinhögl, G. Schindler, G. Steinlesberger, M. Traving, M. Engelhardt

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 304 KB

english, 2004

3

Nucleation and growth of ECD Cu on PVD TiN from low acid sulfate electrolyte

L. Magagnin, A. Vicenzo, M. Bain, H.W. Toh, H.S. Gamble, P.L. Cavallotti

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 423 KB

english, 2004

4

Materials for advanced metallization MAM2004

Gerald Beyer, Karen Maex, Muriel de Potter

Journal:

Microelectronic Engineering

Year:

2004

File:

PDF, 15 KB

2004

5

Characterization and integration of a CVD porous SiOCH (k 

L.L. Chapelon, V. Arnal, M. Broekaart, L.G. Gosset, J. Vitiello, J. Torres

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 465 KB

english, 2004

6

Etch and strip induced material modification of porous low-k (k = 2.2) dielectric

Y. Furukawa, R. Wolters, H. Roosen, J.H.M. Snijders, R. Hoofman

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 434 KB

english, 2004

7

Thermal stability of titanium nitride diffusion barrier films for advanced silver interconnects

L. Gao, J. Gstöttner, R. Emling, M. Balden, Ch. Linsmeier, A. Wiltner, W. Hansch, D. Schmitt-Landsiedel

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 455 KB

english, 2004

8

Development of a hybrid CVD/SOD integration sequence for reliable, high performance interconnect systems

J. Waeterloos, S. Cummings, Y. Ohmoto, L. Archer, R. Stevens, S. Lucero, K. Yang, J. Im, M. Mills, R. Strittmatter, E. Beach, S. Rozeveld

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 442 KB

english, 2004

9

Influence of ultrathin templates on the epitaxial growth of CrSi2 on Si(0 0 1)

O. Filonenko, A. Mogilatenko, H. Hortenbach, F. Allenstein, G. Beddies, H.-J. Hinneberg

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 1.00 MB

english, 2004

10

Effect of deposition temperature on the formation of CoSi2 through the rapid thermal annealing of CVD cobalt

M.F. Bain, N. Deo, B.M. Armstrong, H.S. Gamble

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 428 KB

english, 2004

11

Influence of the electron mean free path on the resistivity of thin metal films

W. Zhang, S.H. Brongersma, O. Richard, B. Brijs, R. Palmans, L. Froyen, K. Maex

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 343 KB

english, 2004

12

The novel use of low temperature hydrogenated microcrystalline silicon germanium (μcSiGe:H) for MEMS applications

M. Gromova, K. Baert, C. Van Hoof, A. Mehta, A. Witvrouw

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 404 KB

english, 2004

13

Studies of structures elaborated by focused ion beam induced deposition

M. Prestigiacomo, L. Roussel, A. Houël, P. Sudraud, F. Bedu, D. Tonneau, V. Safarov, H. Dallaporta

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 447 KB

english, 2004

14

Effects of various Co/TiN and Co/Ti layer stacks and the salicide rapid thermal process conditions on cobalt silicide formation

S. Buschbaum, O. Fursenko, D. Bolze, D. Wolansky, V. Melnik, J. Nieß, W. Lerch

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 298 KB

english, 2004

15

Formation and evolution of grain structures in thin films

Max O. Bloomfield, Timothy S. Cale

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 439 KB

english, 2004

16

The influence of a structurally induced current crowding on electromigration

H. Wang, C. Bruynseraede, D. Chiaradia, K. Maex

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 380 KB

english, 2004

17

Thin films stress extraction using micromachined structures and wafer curvature measurements

J. Laconte, F. Iker, S. Jorez, N. André, J. Proost, T. Pardoen, D. Flandre, J.-P. Raskin

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 369 KB

english, 2004

18

Committees

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 190 KB

english, 2004

19

SiO2 aerogel ultra low k dielectric patterning using different hard mask concepts and stripping processes

F. Blaschta, K. Schulze, S.E. Schulz, T. Gessner

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 609 KB

english, 2004

20

Continuity and morphology of TaN barriers deposited by Atomic Layer Deposition and comparison with physical vapor deposition

Wim F.A. Besling, Marie-Laurence Ignacimouttou, Aurelie Humbert, Maxime Mellier, Joaquin Torres

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 891 KB

english, 2004

21

Leakage mechanism in a porous organic low-k polymer

Y.-L. Li, Zs. Tökei, K. Maex

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 478 KB

english, 2004

22

Modeling of chemical–mechanical polishing on patterned wafers as part of integrated topography process simulation

P.-H. Nguyen, E. Bär, J. Lorenz, H. Ryssel

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 492 KB

english, 2004

23

Impact of different slurry and polishing pad choices on the planarization efficiency of a copper CMP process

Viet H. Nguyen, Roel Daamen, Romano Hoofman

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 394 KB

english, 2004

24

Three-dimensional simulation of ionized metal plasma vapor deposition

S. Kistler, E. Bär, J. Lorenz, H. Ryssel

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 381 KB

english, 2004

25

Influence of SiH4 process step on physical and electrical properties of advanced copper interconnects

S. Chhun, L.G. Gosset, N. Casanova, J.F. Guillaumond, P. Dumont-Girard, X. Federspiel, R. Pantel, V. Arnal, L. Arnaud, J. Torres

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 478 KB

english, 2004

26

High affinity self-assembled monolayers for copper CVD

P. Doppelt, N. Semaltianos, C. Deville Cavellin, J.L. Pastol, D. Ballutaud

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 459 KB

english, 2004

27

Plasma sealing of a low-K dielectric polymer

A. Martin Hoyas, J. Schuhmacher, C.M. Whelan, J.P. Celis, K. Maex

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 381 KB

english, 2004

28

Improvement of mechanical integrity of ultra low k dielectric stack and CMP compatibility

K. Schulze, S.E. Schulz, S. Frühauf, H. Körner, U. Seidel, D. Schneider, T. Gessner

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 647 KB

english, 2004

29

Silylation of porous methylsilsesquioxane films in supercritical carbon dioxide

Bo Xie, Anthony J Muscat

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 388 KB

english, 2004

30

High mobility SiGe heterostructures fabricated by low-energy plasma-enhanced chemical vapor deposition

H. von Känel, D. Chrastina, B. Rössner, G. Isella, J.P. Hague, M. Bollani

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 293 KB

english, 2004

31

Relaxed SiGe heteroepitaxy on Si with very thin buffer layers: experimental LEPECVD indications and an interpretation based on strain-dependent dislocation nature

A. Marzegalli, F. Montalenti, M. Bollani, Leo Miglio, G. Isella, D. Chrastina, H. von Känel

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 489 KB

english, 2004

32

In situ study of stress evolution during the reaction of a nickel film with a silicon substrate

Christian Rivero, Patrice Gergaud, Olivier Thomas, Benoit Froment, Hervé Jaouen

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 408 KB

english, 2004

33

Phase formations in Co–Silicon system

F. Corni, R. Tonini, G. Ottaviani, S. Alberici, D. Erbetta, T. Marangon

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 348 KB

english, 2004

34

The electrodeposition of cobalt–nickel–iron high aspect ratio thick film structures for magnetic MEMS applications

Yelena Sverdlov, Yuri Rosenberg, Yu.I. Rozenberg, Ron Zmood, Raviv Erlich, Sivan Natan, Yosi Shacham-Diamand

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 498 KB

english, 2004

35

Organic contamination study for adhesion enhancement between final passivation surface and packaging molding compound

S. Alberici, A. Dellafiore, G. Manzo, G. Santospirito, C.M. Villa, L. Zanotti

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 501 KB

english, 2004

36

Copper–titanium thin film interaction

L. Castoldi, G. Visalli, S. Morin, P. Ferrari, S. Alberici, G. Ottaviani, F. Corni, R. Tonini, C. Nobili, M. Bersani

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 300 KB

english, 2004

37

High temperature behavior of Cu films studied in-situ by Electron Backscatter Diffraction

K. Mirpuri, H. Wendrock, S. Menzel, K. Wetzig, J. Szpunar

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 406 KB

english, 2004

38

Creep characterization of Al alloy thin films for use in MEMS applications

R. Modlinski, A. Witvrouw, P. Ratchev, R. Puers, J.M.J. den Toonder, I. De Wolf

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 1.01 MB

english, 2004

39

Low temperature spike anneal for Ni-silicide formation

A. Lauwers, J.A. Kittl, M. Van Dal, O. Chamirian, R. Lindsay, M. de Potter, C. Demeurisse, C. Vrancken, K. Maex, X. Pagès, K. Van der Jeugd, V. Kuznetsov, E. Granneman

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 625 KB

english, 2004

40

Investigation of NiAlN as gate-material for submicron CMOS technology

J.K. Efavi, M.C. Lemme, T. Mollenhauer, T. Wahlbrink, T. Bobek, D. Wang, H.D.B. Gottlob, H. Kurz

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 515 KB

english, 2004

41

On the mechanism of annealing effect in electrical resistivity of sub-100 nm Ag (1% W) films

E. Glickman, A. Inberg, V. Bogush, G. Aviram, N. Croitoru, Y. Shacham-Diamand

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 473 KB

english, 2004

42

Grain growth in copper interconnect lines

W. Wu, D. Ernur, S.H. Brongersma, M. Van Hove, K. Maex

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 392 KB

english, 2004

43

Thermo-mechanical behavior and microstructural evolution of electrochemically deposited low-alloyed Cu(Ag) thin films

S. Strehle, S. Menzel, H. Wendrock, J. Acker, T. Gemming, K. Wetzig

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 443 KB

english, 2004

44

Contents

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 144 KB

english, 2004

45

Editorial board

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 31 KB

english, 2004

46

Editorial board

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 15 KB

english, 2004

47

Author index

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 148 KB

english, 2004

48

Materials issues in the processing, the operation and the reliability of MEMS

A. Witvrouw, H.A.C. Tilmans, I. De Wolf

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 824 KB

english, 2004

49

Ultra low stress and low temperature patternable silicone materials for applications within microelectronics

H. Meynen, M. Vanden Bulcke, M. Gonzalez, B. Harkness, G. Gardner, J. Sudbury-Holtschlag, B. Vandevelde, C. Winters, E. Beyne

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 608 KB

english, 2004

50

Boundary texture and scattering: practical directions to a soft diode

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 475 KB

english, 2004

51

Preface

Gerald Beyer, Muriel de Potter, Karen Maex

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 202 KB

english, 2004

52

Damage minimized plasma pore sealing of microporous low k dielectrics

Thomas Abell, Karen Maex

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 352 KB

english, 2004

53

Ultra thin CVD TiN layers as diffusion barrier films on porous low-k materials

J. Bonitz, S.E. Schulz, T. Gessner

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 480 KB

english, 2004

54

Formation of ternary Ni-silicide on relaxed and strained SiGe layers

Q.T. Zhao, D. Buca, St. Lenk, R. Loo, M. Caymax, S. Mantl

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 327 KB

english, 2004

55

Reaction of Ni and Si0.8Ge0.2: phase formation and thermal stability

O. Chamirian, A. Lauwers, J.A. Kittl, M. Van Dal, M. De Potter, R. Lindsay, K. Maex

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 554 KB

english, 2004

56

Structure and properties of CrSi2/Si multilayers

D. Decker, E. Loos, Chr. Drobniewski, A. Mogilatenko, J. Schumann, G. Beddies, H.-J. Hinneberg

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 302 KB

english, 2004

57

Investigation of Ni fully silicided gates for sub-45 nm CMOS technologies

M.A. Pawlak, J.A. Kittl, O. Chamirian, A. Veloso, A. Lauwers, T. Schram, K. Maex, A. Vantomme

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 327 KB

english, 2004

58

Line resistance behaviour in narrow lines patterned by a TiN hard mask spacer for 45 nm node interconnects

W.F.A. Besling, M. Broekaart, V. Arnal, J. Torres

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 529 KB

english, 2004

59

Structural and electronic properties of one dimensional inorganic and organic structures on surfaces

L. Gavioli, M. Fanetti, M.G. Betti, M. Sancrotti

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 438 KB

english, 2004

60

Correlation between barrier integrity and TDDB performance of copper porous low-k interconnects

Zs. Tőkei, M. Patz, M. Schmidt, F. Iacopi, S. Demuynck, K. Maex

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 379 KB

english, 2004

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