Organic contamination study for adhesion enhancement...

Microelectronic Engineering 2004 Vol. 76; Iss. 1-4

Organic contamination study for adhesion enhancement between final passivation surface and packaging molding compound

S. Alberici, A. Dellafiore, G. Manzo, G. Santospirito, C.M. Villa, L. Zanotti
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Volume:
76
Year:
2004
Language:
english
Pages:
8
DOI:
10.1016/j.mee.2004.07.040
File:
PDF, 501 KB
english, 2004
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