Silicon etch process options for micro- and nanotechnology...

Microelectronic Engineering 2006 Vol. 83; Iss. 4-9

Silicon etch process options for micro- and nanotechnology using inductively coupled plasmas

C.C. Welch, A.L. Goodyear, T. Wahlbrink, M.C. Lemme, T. Mollenhauer
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Volume:
83
Year:
2006
Language:
english
Pages:
4
DOI:
10.1016/j.mee.2006.01.079
File:
PDF, 455 KB
english, 2006
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