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Filling trenches on a SiO2 substrate with Cu using a hot refractory anode vacuum arc
I.I. Beilis, D. Grach, A. Shashurin, R.L. BoxmanVolume:
85
Year:
2008
Language:
english
Pages:
4
DOI:
10.1016/j.mee.2008.04.018
File:
PDF, 499 KB
english, 2008