RF characterization and modelling of high density Through...

Microelectronic Engineering 2010 Vol. 87; Iss. 3

RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

L. Cadix, C. Bermond, C. Fuchs, A. Farcy, P. Leduc, L. DiCioccio, M. Assous, M. Rousseau, F. Lorut, L.L. Chapelon, B. Flechet, N. Sillon, P. Ancey
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Volume:
87
Year:
2010
Language:
english
Pages:
5
DOI:
10.1016/j.mee.2009.08.026
File:
PDF, 593 KB
english, 2010
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