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Increasing the bonding strength of chips on flex substrates using thermosonic flip-chip bonding process with nonconductive paste
Cheng-Li Chuang, Qing-An Liao, Hsun-Tien Li, Shi-Jie Liao, Guo-Shing HuangVolume:
87
Year:
2010
Language:
english
Pages:
7
DOI:
10.1016/j.mee.2009.08.027
File:
PDF, 760 KB
english, 2010