Influence of pin chuck ring seals and polishing steps on...

Microelectronic Engineering 2010 Vol. 87; Iss. 5-8

Influence of pin chuck ring seals and polishing steps on wafer flatness

Atsunobu Une, Kenichiro Yoshitomi, Masaaki Mochida, Nagahisa Ogasawara
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
87
Year:
2010
Language:
english
Pages:
4
DOI:
10.1016/j.mee.2009.10.020
File:
PDF, 576 KB
english, 2010
Conversion to is in progress
Conversion to is failed