Experimental study on the thermo-mechanical effects of...

Microelectronics Reliability 2006 Vol. 46; Iss. 5-6

Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device

Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo, Masayuki Kaneto
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Volume:
46
Year:
2006
Language:
english
Pages:
7
DOI:
10.1016/j.microrel.2005.02.013
File:
PDF, 537 KB
english, 2006
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