Deformation mechanism and its effect on electrical...

Microelectronics Reliability 2006 Vol. 46; Iss. 2-4

Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study

Woon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik
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Volume:
46
Year:
2006
Language:
english
Pages:
11
DOI:
10.1016/j.microrel.2005.06.014
File:
PDF, 655 KB
english, 2006
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