Microstructure evolution of the Sn–Ag–y%Cu interconnect

Microelectronics Reliability 2006 Vol. 46; Iss. 7

Microstructure evolution of the Sn–Ag–y%Cu interconnect

Henry Y. Lu, Haluk Balkan, K.Y. Simon Ng
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Volume:
46
Year:
2006
Language:
english
Pages:
13
DOI:
10.1016/j.microrel.2005.08.004
File:
PDF, 933 KB
english, 2006
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