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Volume 46; Issue 7
Main
Microelectronics Reliability
Volume 46; Issue 7
Microelectronics Reliability
Volume 46; Issue 7
1
Stability of the warpage in a PBGA package subjected to hygro-thermal loading
Chi-Hui Chien
,
Thaiping Chen
,
Yung-Chang Chen
,
Yii-Tay Chiou
,
Chi-Chang Hsieh
,
Yii-Der Wu
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 186 KB
Your tags:
english, 2006
2
Optimizing the controller IC for micro HDD process based on Taguchi methods
Y.H. Hung
,
M.L. Huang
,
C.H. Chang
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 165 KB
Your tags:
english, 2006
3
Failure analysis and solutions to overcome latchup failure event of a power controller IC in bulk CMOS technology
Shih-Hung Chen
,
Ming-Dou Ker
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 630 KB
Your tags:
english, 2006
4
Experimental study and life prediction on high cycle vibration fatigue in BGA packages
Xia Liu
,
Valmiki K. Sooklal
,
Melody A. Verges
,
Michael C. Larson
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 806 KB
Your tags:
english, 2006
5
Thermally induced deformation of solder joints in real packages: Measurement and analysis
Hua Lu
,
Helen Shi
,
Ming Zhou
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 619 KB
Your tags:
english, 2006
6
A MAIC approach to TFT-LCD panel quality improvement
K.S. Chen
,
C.H. Wang
,
H.T. Chen
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 289 KB
Your tags:
english, 2006
7
Drop impact reliability testing for lead-free and lead-based soldered IC packages
Desmond Y.R. Chong
,
F.X. Che
,
John H.L. Pang
,
Kellin Ng
,
Jane Y.N. Tan
,
Patrick T.H. Low
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 730 KB
Your tags:
english, 2006
8
Microstructure evolution of the Sn–Ag–y%Cu interconnect
Henry Y. Lu
,
Haluk Balkan
,
K.Y. Simon Ng
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 933 KB
Your tags:
english, 2006
9
Evaluation of board-level reliability of electronic packages under consecutive drops
Chang-Lin Yeh
,
Yi-Shao Lai
,
Chin-Li Kao
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 280 KB
Your tags:
english, 2006
10
Balancing temperature dependence of on-wafer SOS inductors
Päivi H. Karjalainen
,
Eero O. Ristolainen
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 274 KB
Your tags:
english, 2006
11
Modeling and simulation of resistivity of nanometer scale copper
A. Emre Yarimbiyik
,
Harry A. Schafft
,
Richard A. Allen
,
Mona E. Zaghloul
,
David L. Blackburn
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 172 KB
Your tags:
english, 2006
12
R. Jacob Baker, ,CMOS Circuit Design, Layout, and Simulation second ed. (2005) Wiley Interscience & IEEE Press 0-471-70055-X Hardcover, pp. 1039, plus XXXIII.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 58 KB
Your tags:
english, 2006
13
Effects of bonding force on contact pressure and frictional energy in wire bonding
Yong Ding
,
Jang-Kyo Kim
,
Pin Tong
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 604 KB
Your tags:
english, 2006
14
Stabilized emission from micro-field emitter for electron microscopy
L. Chen
,
M.M. El-Gomati
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 223 KB
Your tags:
english, 2006
15
Definition of curve fitting parameter to study tunneling and trapping of electrons in Si/ultra-thin SiO2/metal structures
V. Filip
,
Hei Wong
,
D. Nicolaescu
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 219 KB
Your tags:
english, 2006
16
Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure
M. Yamashita
,
K. Suganuma
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 266 KB
Your tags:
english, 2006
17
The effect of hygro-mechanical and thermo-mechanical stress on delamination of gold bump
Dae Whan Kim
,
Byung-Seon Kong
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 492 KB
Your tags:
english, 2006
18
Major factors to the solder joint strength of ENIG layer in FC BGA package
Dong-Jun Lee
,
Hyo S. Lee
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 736 KB
Your tags:
english, 2006
19
Tin whisker formation of lead-free plated leadframes
K.S. Kim
,
C.H. Yu
,
J.M. Yang
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 584 KB
Your tags:
english, 2006
20
Test structure assembly for bump bond yield measurement on high density flip chip technologies
M. Ullán
,
M. Lozano
,
M. Chmeissani
,
G. Blanchot
,
E. Cabruja
,
J. García
,
M. Maiorino
,
R. Martínez
,
G. Pellegrini
,
C. Puigdengoles
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 324 KB
Your tags:
english, 2006
21
Constructing IP cores’ transparency paths for SoC test access using greedy search
Jianhui Xing
,
Hong Wang
,
Shiyuan Yang
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 194 KB
Your tags:
english, 2006
22
The post-damage behavior of a MOS tunnel emitter transistor
S.E. Tyaginov
,
M.I. Vexler
,
A.F. Shulekin
,
I.V. Grekhov
Journal:
Microelectronics Reliability
Year:
2006
Language:
english
File:
PDF, 568 KB
Your tags:
english, 2006
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