Electrothermal coupling analysis of current crowding and...

Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages

Yi-Shao Lai, Chin-Li Kao
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Volume:
46
Year:
2006
Language:
english
Pages:
12
DOI:
10.1016/j.microrel.2005.08.009
File:
PDF, 847 KB
english, 2006
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