Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au...

Microelectronics Reliability 2006 Vol. 46; Iss. 8

Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads

Petar Ratchev, Serguei Stoukatch, Bart Swinnen
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Volume:
46
Year:
2006
Language:
english
Pages:
11
DOI:
10.1016/j.microrel.2005.11.002
File:
PDF, 663 KB
english, 2006
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