Reliability studies of barrier layers for Cu/PAE low-k...

Microelectronics Reliability 2006 Vol. 46; Iss. 8

Reliability studies of barrier layers for Cu/PAE low-k interconnects

H.S. Nguyen, Z.H. Gan, Zhe Chen, V. Chandrasekar, K. Prasad, S.G. Mhaisalkar, Ning Jiang
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Volume:
46
Year:
2006
Language:
english
Pages:
6
DOI:
10.1016/j.microrel.2005.11.005
File:
PDF, 405 KB
english, 2006
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