Development of highly accelerated electromigration test

Microelectronics Reliability 2006 Vol. 46; Iss. 9-11

Development of highly accelerated electromigration test

Cher Ming Tan, Wei Li, Kok Tong Tan, Frankie Low
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Volume:
46
Year:
2006
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2006.07.034
File:
PDF, 1.59 MB
english, 2006
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