The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics
J.R. Lloyd, C.E. Murray, S. Ponoth, S. Cohen, E. LinigerVolume:
46
Year:
2006
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2006.08.003
File:
PDF, 452 KB
english, 2006