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Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu
Weiqun Peng, Eduardo Monlevade, Marco E. MarquesVolume:
47
Year:
2007
Language:
english
Pages:
8
DOI:
10.1016/j.microrel.2006.12.006
File:
PDF, 1.20 MB
english, 2007