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Volume 47; Issue 12
Main
Microelectronics Reliability
Volume 47; Issue 12
Microelectronics Reliability
Volume 47; Issue 12
1
Taxonomies for the Development and Verification of Digital Systems, Brian Bailey, Grant Martin, Thomas Anderson (Editors). Springer, New York (2005). 179 pp., Hardcover, ISBN: 0-387-24019-5.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 65 KB
Your tags:
english, 2007
2
Simulation and fabrication of magnetic rotary microgenerator with multipolar Nd/Fe/B magnet
C.T. Pan
,
T.T. Wu
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.07 MB
Your tags:
english, 2007
3
Impact of board and component metallizations on microstructure and reliability of lead-free solder joints
A.R. Zbrzezny
,
P. Snugovsky
,
D.D. Perovic
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 2.20 MB
Your tags:
english, 2007
4
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition
Chang-Lin Yeh
,
Tsung-Yueh Tsai
,
Yi-Shao Lai
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 981 KB
Your tags:
english, 2007
5
William C.Y. Lee, ,Wireless & Cellular Telecommunications third ed. (2006) McGraw Hill,New York 0-07-143686-3 Hardcover, 822 pp., plus XXIII.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 73 KB
Your tags:
english, 2007
6
A straightforward analytical method for extraction of semiconductor device transient thermal parameters
F.N. Masana
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 320 KB
Your tags:
english, 2007
7
High-temperature performance of state-of-the-art triple-gate transistors
K. Akarvardar
,
A. Mercha
,
E. Simoen
,
V. Subramanian
,
C. Claeys
,
P. Gentil
,
S. Cristoloveanu
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 378 KB
Your tags:
english, 2007
8
Study of the electrolyte-insulator-semiconductor field-effect transistor (EISFET) with applications in biosensor design
M. Waleed Shinwari
,
M. Jamal Deen
,
Dolf Landheer
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 3.04 MB
Your tags:
english, 2007
9
Effects of width scaling and layout variation on dual damascene copper interconnect electromigration
M.H. Lin
,
K.P. Chang
,
K.C. Su
,
Tahui Wang
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 727 KB
Your tags:
english, 2007
10
Coupled electro-thermal simulation of a DC/DC converter
Miquel Vellvehi
,
Xavier Jordà
,
Philippe Godignon
,
Carles Ferrer
,
José Millán
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.33 MB
Your tags:
english, 2007
11
Low frequency noise in nMOSFETs with subnanometer EOT hafnium-based gate dielectrics
P. Magnone
,
C. Pace
,
F. Crupi
,
G. Giusi
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 266 KB
Your tags:
english, 2007
12
An experimental study of the thermally activated processes in polycrystalline silicon thin film transistors
L. Michalas
,
M. Exarchos
,
G.J. Papaioannou
,
D.N. Kouvatsos
,
A.T. Voutsas
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.04 MB
Your tags:
english, 2007
13
Multiple high-voltage pulse stressing of conventional thick-film resistors
I. Stanimirović
,
M.M. Jevtić
,
Z. Stanimirović
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 298 KB
Your tags:
english, 2007
14
Isothermal aging effects on flex cracking of multilayer ceramic capacitors with standard and flexible terminations
Mohammadreza Keimasi
,
Michael H. Azarian
,
Michael Pecht
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 2.41 MB
Your tags:
english, 2007
15
Dynamic behavior of resistive faults in nanometer technology
Mayuri Kunchwar
,
Reza Sedaghat
,
Vadim Geurkov
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 258 KB
Your tags:
english, 2007
16
Predicting the process induced warpage of electronic packages using the P–V–T–C equation and the Taguchi method
Shiang-Yu Teng
,
Sheng-Jye Hwang
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.28 MB
Your tags:
english, 2007
17
Electrical measurements of voltage stressed Al2O3/GaAs MOSFET
Z. Tang
,
P.D. Ye
,
D. Lee
,
C.R. Wie
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 388 KB
Your tags:
english, 2007
18
Prognostics implementation of electronics under vibration loading
Jie Gu
,
Donald Barker
,
Michael Pecht
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 696 KB
Your tags:
english, 2007
19
A maintenance planning and business case development model for the application of prognostics and health management (PHM) to electronic systems
Peter A. Sandborn
,
Chris Wilkinson
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 394 KB
Your tags:
english, 2007
20
Electronic prognostics for switched mode power supplies
Douglas Goodman
,
James Hofmeister
,
Justin Judkins
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 515 KB
Your tags:
english, 2007
21
Introduction to special section on electronic systems prognostics and health management
Peter Sandborn
,
Michael Pecht
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 333 KB
Your tags:
english, 2007
22
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
Artur Wymysłowski
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 63 KB
Your tags:
english, 2007
23
Fatigue and thermal fatigue damage analysis of thin metal films
G.P. Zhang
,
C.A. Volkert
,
R. Schwaiger
,
R. Mönig
,
O. Kraft
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 920 KB
Your tags:
english, 2007
24
Measuring the through-plane elastic modulus of thin polymer films in situ
M. van Soestbergen
,
L.J. Ernst
,
K.M.B. Jansen
,
W.D. van Driel
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 347 KB
Your tags:
english, 2007
25
Finite-element model-based fault diagnosis, a case study of a ceramic pressure sensor structure
Marina Santo Zarnik
,
Darko Belavič
,
Franc Novak
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 524 KB
Your tags:
english, 2007
26
Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules
Daniel T. Rooney
,
Louis Gullo
,
Dongji Xie
,
N. Todd Castello
,
Dongkai Shangguan
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.33 MB
Your tags:
english, 2007
27
Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging
Ja-Myeong Koo
,
Seung-Boo Jung
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.57 MB
Your tags:
english, 2007
28
Evaluation of solder joint strengths under ball impact test
Yi-Shao Lai
,
Hsiao-Chuan Chang
,
Chang-Lin Yeh
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.27 MB
Your tags:
english, 2007
29
Polarity asymmetry of stress and charge trapping behavior of thin Hf- and Zr-silicate layers
A. Paskaleva
,
M. Lemberger
,
A.J. Bauer
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 322 KB
Your tags:
english, 2007
30
Testing process precision for truncated normal distributions
W.L. Pearn
,
H.N. Hung
,
N.F. Peng
,
C.Y. Huang
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 399 KB
Your tags:
english, 2007
31
Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu
Weiqun Peng
,
Eduardo Monlevade
,
Marco E. Marques
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.20 MB
Your tags:
english, 2007
32
Analysis of interior degradation of a laser waveguide using an OBIC monitor
Tatsuya Takeshita
,
Ryuzo Iga
,
Mitsuo Yamamoto
,
Mitsuru Sugo
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 478 KB
Your tags:
english, 2007
33
Life cycle cost impact of using prognostic health management (PHM) for helicopter avionics
E. Scanff
,
K.L. Feldman
,
S. Ghelam
,
P. Sandborn
,
M. Glade
,
B. Foucher
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 569 KB
Your tags:
english, 2007
34
Feature extraction and damage-precursors for prognostication of lead-free electronics
Pradeep Lall
,
Madhura Hande
,
Chandan Bhat
,
Nokibul Islam
,
Jeff Suhling
,
Jay Lee
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 2.02 MB
Your tags:
english, 2007
35
Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion
O. van der Sluis
,
R.A.B. Engelen
,
R.B.R. van Silfhout
,
W.D. van Driel
,
M.A.J. van Gils
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 895 KB
Your tags:
english, 2007
36
Adhesion of arbitrary-shaped thin-film microstructures
Dhruv Bhate
,
Martin L. Dunn
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.27 MB
Your tags:
english, 2007
37
Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device
Y. Yamada
,
Y. Takaku
,
Y. Yagi
,
I. Nakagawa
,
T. Atsumi
,
M. Shirai
,
I. Ohnuma
,
K. Ishida
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.07 MB
Your tags:
english, 2007
38
Metal gates and gate-deposition-induced defects in Ta2O5 stack capacitors
E. Atanassova
,
D. Spassov
,
A. Paskaleva
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 197 KB
Your tags:
english, 2007
39
Louis Scheffer, Luciano Lavagno, Grant Martin,Editors, ,Electronic Design Automation for Integrated Circuits Handbook Vols. I and II (2006) CRC, imprint of Taylor and Francis Group,Boca Raton 0-8493-3096-3 Hardcover, 1095 pp., plus XLVIII.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 69 KB
Your tags:
english, 2007
40
Stress induced gate–drain leakage current in ultra-thin gate oxide
C. Petit
,
D. Zander
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 871 KB
Your tags:
english, 2007
41
Board level drop test and simulation of leaded and lead-free BGA-PCB assembly
Xin Qu
,
Zhaoyi Chen
,
Bo Qi
,
Taekoo Lee
,
Jiaji Wang
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 2.25 MB
Your tags:
english, 2007
42
Deformation analysis in microstructures and micro-devices
Zhanwei Liu
,
Huimin Xie
,
Daining Fang
,
Changzhi Gu
,
Yonggang Meng
,
Weining Wang
,
Yan Fang
,
Jianmin Miao
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 819 KB
Your tags:
english, 2007
43
Drop simulation/experimental verification and shock resistance improvement of TFT–LCD monitors
Min-Chun Pan
,
Po-Chun Chen
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 4.52 MB
Your tags:
english, 2007
44
Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages
Andy Perkins
,
Suresh K. Sitaraman
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 486 KB
Your tags:
english, 2007
45
Fast, Efficient and Predictable Memory Access: Optimization Algorithms for Memory Architecture Aware Compilation, Lars Wehmeyer, Peter Marwedel. Springer, Dordercht, The Netherlands (2006). 257 pp., Hardcover, plus XI, ISBN: 1-4020-4821-1
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 64 KB
Your tags:
english, 2007
46
Simplified terrain identification and component fatigue damage estimation model for use in a health and usage monitoring system
Richard Heine
,
Donald Barker
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 425 KB
Your tags:
english, 2007
47
Advanced electronic prognostics through system telemetry and pattern recognition methods
Leon Lopez
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 453 KB
Your tags:
english, 2007
48
Concept of smart integrated life consumption monitoring system for electronics
Vincent Rouet
,
Frédéric Minault
,
Guillaume Diancourt
,
Bruno Foucher
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.46 MB
Your tags:
english, 2007
49
Electronic prognostics – A case study using global positioning system (GPS)
Douglas W. Brown
,
Patrick W. Kalgren
,
Carl S. Byington
,
Michael J. Roemer
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.75 MB
Your tags:
english, 2007
50
Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling
Yoshikuni Nakadaira
,
Seyoung Jeong
,
Jongbo Shim
,
Jaiseok Seo
,
Sunhee Min
,
Taeje Cho
,
Sayoon Kang
,
Seyong Oh
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 5.24 MB
Your tags:
english, 2007
51
Facing the challenge of designing for Cu/low-k reliability
W.D. van Driel
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.40 MB
Your tags:
english, 2007
52
Influence of matrix viscoelastic properties on thermal conductivity of TCA – Numerical approach
Tomasz Falat
,
Artur Wymysłowski
,
Jana Kolbe
,
Kaspar M.B. Jansen
,
Leo Ernst
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.16 MB
Your tags:
english, 2007
53
Microstructural considerations for ultrafine lead free solder joints
Zhiheng Huang
,
Paul P. Conway
,
Rachel C. Thomson
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.47 MB
Your tags:
english, 2007
54
The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages
Jinlin Wang
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.19 MB
Your tags:
english, 2007
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