Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling
Yoshikuni Nakadaira, Seyoung Jeong, Jongbo Shim, Jaiseok Seo, Sunhee Min, Taeje Cho, Sayoon Kang, Seyong OhVolume:
48
Year:
2008
Language:
english
Pages:
22
DOI:
10.1016/j.microrel.2007.01.091
File:
PDF, 5.92 MB
english, 2008