High temperature reliability of aluminium wire-bonds to...

High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization

Rolf Johannessen, Frøydis Oldervoll, Frode Strisland
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Volume:
48
Year:
2008
Language:
english
Pages:
9
DOI:
10.1016/j.microrel.2008.06.008
File:
PDF, 1.11 MB
english, 2008
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