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An investigation of reliability of solder joints in microelectronic packages by high temperature moiré method
Haixia Shang, Jianxin Gao, P. Ian Nicholson, Steve KennyVolume:
51
Year:
2011
Language:
english
Pages:
9
DOI:
10.1016/j.microrel.2010.12.012
File:
PDF, 1.56 MB
english, 2011