A Molded Package Optimized for High Voltage SiC-Devices
Dohnke, Karl Otto, Bartsch, Wolfgang, Schörner, Reinhold, Van Weelden, T.Volume:
679-680
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.679-680.762
Date:
March, 2011
File:
PDF, 1.40 MB
english, 2011