Microwave bonding of polymer-based substrates for potential...

Sensors and Actuators A: Physical 2004 Vol. 114; Iss. 2-3

Microwave bonding of polymer-based substrates for potential encapsulated micro/nanofluidic device fabrication

Kin Fong Lei, Syed Ahsan, Nasser Budraa, Wen J. Li, John D. Mai
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Volume:
114
Year:
2004
Language:
english
Pages:
7
DOI:
10.1016/j.sna.2003.12.018
File:
PDF, 443 KB
english, 2004
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