Interface Defects of Bonded Silicon Wafers
Reiche, M., Tong, Q.-Y., Gösele, U.M., Heydenreich, J.Volume:
196-201
Year:
1995
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.196-201.1847
File:
PDF, 635 KB
1995