Interface Defects of Bonded Silicon Wafers

Interface Defects of Bonded Silicon Wafers

Reiche, M., Tong, Q.-Y., Gösele, U.M., Heydenreich, J.
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Volume:
196-201
Year:
1995
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.196-201.1847
File:
PDF, 635 KB
1995
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